Rigid Printed Circuits Equipment
  • Air compressor system
  • Auto deseamer and etch back system
  • Auto electroless copper plating system
  • Auto gold-finger plating M/C
  • Auto inner layer oxidation system
  • Auto panel copper plating system
  • Auto pattern system
  • Automatic Hot Transfer Laminating Press
  • Baking ovens
  • Bevelmaster
  • Carbon treatment system
  • Clean room
  • CNC Drilling M/C
  • CNC Router
  • Computerized Programming M/C
  • Conveyorized oven
  • D.I. water system
  • Deburning/Scrubbing M/C
  • Dehumidifier
  • Drill pinning machine
  • Dry-film developing/Acid etching/Film stripping system
  • Dry-film exposure M/C
  • Dry-film laminator
  • Final clean M/C
  • High-voltage O/S Test M/C
  • Hot air solder levelling M/C
  • Laminating Press Line
  • Lay-up Process Line
  • Liquid solder-mask developing M/C
  • Liquid solder-mask exposure M/C
  • Low-voltage O/S Test M/C
  • Manual gold plating M/C
  • Manual Screen Printer
  • Post-treatment M/C of HAL
  • Pre-treatment M/c for HAL
  • Punching M/C
  • Refrigerator system
  • Semi-auto Screen printing M/C
  • Semi-auto vacuum film packing M/C
  • Slotting M/C
  • Universal O/S Test M/C
  • V-Groove machine
  • Waste water treatment